Finding Passive Income
Saturday, 24 July 2021
Sunday, 4 July 2021
BOOK VALUE
Benjamin Graham and David Dodd implied to pick stocks with share prices that are way below the company's value to obtain a margin of safety so as not to lose the investment.
The book value of the company is calculated by dividing the net asset with the weighted number of shares. The net asset value = Total assets – Total liabilities.
Total
assets, total liabilities and the weighted number of shares can be found in the
company’s annual report. The annual
report is filed in the U.S. Securities and Exchange Commission as 10-K for U.S.
companies or 20-F for non-U.S. companies. The company filings can be searched
in https://www.sec.gov/edgar/searchedgar/companysearch.html
by searching the company ticker symbol.
For example, using 20-F of ticker symbol GSM for Ferroglobe
PLC and subsidiaries, the book value for year 2020 is calculated as follows:
In the “Consolidated Statement of Financial Position”,
Total assets = $ 1347145 K
Non-current liabilities = $ 548640 K
Current liabilities = $ 432786 K
Total liabilities = Non-current liabilities + current
liabilities = $ 548640 K + $ 432786 K = $ 981426 K
In the “Consolidate Income Statement”
The weighted average basic/diluted shares outstanding =
169269281
Therefore the book value = ($ 1347145 K - $
981426 K) ÷
169269281 = $2.16 per share
On
April 14, 2020, GSM share price = $ 0.471 per share and it is below the book
value by 459%. The discount of 459% to
book value is assumed as the margin of safety.
With the GSM closing price on Jul 2, 2021 = $6.25, the stock price has gained 1227% since April
14, 2020.
Go to this link for the free mobile app for US listed shares
with share prices below book value:
https://winged-prose-8987.glideapp.io/
Reference:
Graham, Benjamin and David, Dodd. 2008. Security Analysis,
sixth edition. New York: McGraw-Hill Education.
Tuesday, 15 June 2021
Central Limit Theorem
In 1989, I had used statistics regularly to solve process problems in semiconductor manufacturing while working as an assistant process engineer for NEC Semiconductors. I had received many awards for solving wire bonding problems and my solutions were presented at the NEC Headquarters in Tokyo, Japan.